Date: September 28, 2023; 09:00 - 17:30 (CET) Location: Zürich, Switzerland & online Organizer: Food Packaging Forum
Don’t miss this one-of-a-kind event in the field of food packaging and health to learn about recent developments in science, business, advocacy, and regulation as well as to share perspectives and experiences! This annual gathering brings together a diverse group of international stakeholders from government, industry, food service, retail, academia, civil society, and beyond. It will be held in a hybrid format that allows participants to join either in person or online to follow and engage in the presentations and discussions from anywhere.
The Food Packaging Forum invites you to join them on Thursday, September 28th for a day of insightful expert presentations, panel discussions, and networking under the theme “Achieving safe and sustainable food packaging: Where are we now?” Discussions throughout the day will reflect on recent advancements made in science, policy, and practice related to food contact materials (FCMs) and health, as well as assess where we are and what still needs to be addressed to achieve safe and sustainable food contact materials and articles in the real world.
Registration is open and can be completed using the form at the bottom of the linked page. Last year’s workshop in 2022 was attended by over 150 participants from across the field and 24 different countries, and you can freely watch all of the recorded talks.
Confirmed Speakers
Speakers presenting at this year’s event include:
Micaël Müller, MIGROS Coffee B
Dagny Tucker, Perpetual
Iris Vilsmaier, CIRCUJAR
Fernando Rodriguez-Mata, New ERA (European Reuse Association)
Lynn Grega, Sherwin-Williams
Anastasia Kiku, Reusables.com
Maricel Marin-Kuan, Nestlé Research
Malte Galleé, Member of the European Parliament
Claudia Giacovelli, UNEP Life Cycle Initiative
Garance Bullenger, Ellen MacArthur Foundation
Clemence Schmidt, LOOP
Andrés Del Castillo, CIEL
Martin Scheringer, ETH Zürich
Additional speakers and the full event program featuring podium presentations, discussion panels, and interactive Q&A sessions will be announced on the webpage in the coming weeks.